Home / Tech / This new 3D chip tech is how Intel will beat Moore’s Law | Engadget Today

This new 3D chip tech is how Intel will beat Moore’s Law | Engadget Today

This new 3D chip tech is how Intel will beat Moore's Law | Engadget Today



Foveros is all about building up, not out.

Read more:
https://www.engadget.com/amp/2018/12/12/intel-foverus-3d-chip/

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40 comments

  1. I think you should move your hands more when you talk.

  2. Smh, this is hardly the answer. If anything, Intel is admitting defeat by doing this.

  3. Just don't leave your computer on for more than 10 minutes or it will melt.

  4. So basically they got lazy and gave up shrinking chips past 14nm

  5. But I think arm based cpu will beat moore's law

  6. So basically they will glue chips together.

  7. Intel still rules cpu market. Thank goodness they are getting their act together though. Bringing some inovation. I hope to see ARM and AMD will keep pushing them. Whilst Intel joining gpu is 2019/20 is fantastic. As nvidia needa a kick up its back side. Well we will see.

  8. Moore's Law means die size double each year, why would they wanna beat that? I thought the problem here is that they still wanna maintain Moore's Law?

  9. Intel will continue to have problems because of their x86 cisc architecture. RISC chips have proven to be more effective at beating the law. ARM, MIPS and Risc-V will dominate the new markets of mobile devices and more efficient servers. Intel's time is up. They can't keep this up, RISC won

  10. Cant wait to see how many Thousands this will cost…….

  11. maybe try to replace the stacking concept with a distributed chiplet concept, try to connect the Memory & Compute chiplet from 2 different die using high-bandwidth & low latency communication rail, such as Optical I/O's. You should recreate the Infinity Fabric.

  12. so phones will get thicker again

  13. Moore law is not a law anymore than ohm law is a law – both only obeyed within limits.

  14. Dude everything u talked about doesn't even exist yet it's just on paper, they don't even know how to cool a 3d chip as of yet. Can it even be done at a reasonable price? The only way its going to happen is integrate the cooling into the chip manufacturing process itself. Sounds like a pipe dream.

  15. We will see you tomorrow (23:59:59) with more Engadget today (00:00:00).
    mystery solved.

  16. Next time i buy a laptop I will be sure to avoid ones with intel processor

  17. The title should be "how Intel will fool shareholders"

  18. Could you please focus (magnify) on different sections! Thank you 🙏🏻

  19. Technological advancement? Boner time.

  20. So, like gluing things together, right?

  21. Intel's problems are staking up. Apple, Qualcomm, and others are coming with better efficiency, faster speed, small foot print, and the list goes on and on. Are you researching before making these videos?

  22. They will probably find a way to cool it, but I think the ideas is to steal consumer's money not beat moore's law, so expect an expansion pack aka rtx raytracing type tricks and gimmicks to make sure you throw money for magicarp i mean magicrap

  23. Moore's law is over 9000.

  24. Amd are working on a 2.5 nm.

  25. Yeah yeah whatever… new? Back in the 80's at one of the world's major aerospace companies I designed and built the first of the 3D architectures using gallium arsenide instead of silicon, with a number of innovations. Aside from the 3D, instead of using internal metallic vias, I used L.E.D.s, which spoke and listened in a spherical holographic cocoon cavity to directly communicate with any port onboard, I used chip caps and detectors to charge the refresh bus locally. I used holographic multiplexed lensing to distribute both power and digital data to each layer, and I operated the digital gates in both that and analog, simultaneously. Operational bandwidth, 32 gigahertz, informational multiverse, 2 THz. Surprise!

  26. Gordon Moore wants to know your location.

  27. Id rather have new battery technology … meh

  28. IBM was stacking ceramic chips in 1984, much more than the 3 years claimed in this video.

  29. If they used liquid metal on their IHS's instead of the gunk they use now, that might give them some headroom as far as heat dissipation is concerned.

  30. AMD are rumoured to be working on a GPU package with multiple GPU Chiplets inside. This is essentially Crossfire, but without the driver knowing about it 🙂

  31. AMD are already mixing and matching Chiplets! 🙂 Intel are trying to catch up.

  32. What about heat output? Wouldn’t this generate a ton more heat since the components are bassically stacked on top of eachother thus reducing the cooling area?

  33. Anyone blown away by the fact that we know we live in a world that constantly gets better?
    Imagine our ancestors, that lived in one that was the same as when they were born, thinking that they could do nothing against its cruelties.

  34. How is it possible to cram so much stupidity into one video title?

  35. Thats what i call marketing reporting. When i hear Intel 3D i just look at this big mouth announcement of Intel Optane. And here the situation is much more troublesome. The big problem is thermal dissipation. You can stack RAM cells, especially Flash a lot because they create almost no heat but computing cores is a total different game. Thats why scientists are working for 20 years on nanopipes that should absorb this heat … but there is no real result not even in the basic foundations, let alone on a commerical usable scale.

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